A general-purpose intelligent electronic defect‑inspection system, primarily used in the automotive electronics, energy electronics, home appliance, consumer electronics, and semiconductor industries. It enables nondestructive testing of a wide range of components, including SMT assemblies, LEDs, BGA packages, packaged devices, IGBTs, semiconductor devices, die‑cast parts, precision structural components, connectors, and other related parts.

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Product Introduction
Technical Specifications
Application Cases

- Commodity name: Offline Micro-Focus Inspection
- Commodity ID: Ax5000
- 设备类型: Microfocus inspection
- 标签蓝: Ultra-High-Definition Imaging System
- 标签绿: Precision BGA Inspection
- 标签橙: Multiple measurement modes
- 标签红: Human-centered design
- 检测类型: Offline individual testing
- 检测方式: 2D/2.5D
- 光管电压: 150 kV
- 特点: Standard Equipment | Electronic X-Ray | Offline Spot-Check Inspection
A general-purpose intelligent electronic defect‑inspection system, primarily used in the automotive electronics, energy electronics, home appliance, consumer electronics, and semiconductor industries. It enables nondestructive testing of a wide range of components, including SMT assemblies, LEDs, BGA packages, packaged devices, IGBTs, semiconductor devices, die‑cast parts, precision structural components, connectors, and other related parts.

Inspected product
Application	Automotive electronics, energy electronics, home appliances, consumer electronics, and semiconductor-related industries
Parameter item	Parameter value
Lamp tube voltage	150kV
Minimum focal spot size	7 μm
Pixel size	85 μm
Imaging area	130×130mm
Spatial resolution	5.8 LP/mm
Detection area	500×500mm
Overall dimensions (approx.)	1.3m(L)×1.5m(W)×1.85m(H)
Overall weight (approx.)	1900kg

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