In the fields of semiconductors, electronic packaging, and precision additive manufacturing, feature sizes have already reached the micrometer—and even nanometer—scale, where even the tiniest defects can render devices inoperable. RAYSOV’s Micro‑Focus Business Unit, centered on micron‑level high‑resolution imaging and advanced intelligent algorithms, provides a “seeing‑through” capability for microscale manufacturing:

Semiconductor and Power Device Packaging:

Detects void fractions in the solder layers of IGBT/MOSFET modules, bond wire connection integrity, delamination of DBC copper-clad ceramic substrates, and chip‑mounting defects; also assesses the uniformity of thermal interface materials and detects microcracks in SiC/GaN device packages.

PCB/PCBA and Electronic Assembly:

Inspect hidden solder joints such as BGA, QFN, and flip-chip for bridging, cold solder joints, the “head‑on‑pillow” (HoP) effect, and internal voids in solder balls; analyze interlayer alignment, via quality, and inner-layer trace defects in multilayer PCBs and HDI boards.

MEMS and Advanced Sensors:

Observe the release mass of the suspended structure, the microstructures within the sealed cavity, and the status of wire bonding in microelectromechanical systems (MEMS).

Precision structural components for consumer electronics:

Inspect the internal porosity and density uniformity of MIM (metal injection molding) components such as phone and wearable device frames and card trays; examine assembly deviations within camera module brackets and optical lenses.

Additive Manufacturing (3D Printing) of Metals and Ceramics:

Full‑size CT inspections are performed on titanium alloy, aluminum alloy, high‑temperature alloy, and tungsten alloy components manufactured by selective laser melting (SLM) and electron beam melting (EBM), enabling precise analysis of internal defects such as lack of fusion, porosity, cracks, inclusions, powder residues, and overall dimensional deviations, thereby providing quantitative feedback for iterative optimization of process parameters.

Intelligent Material-Dispensing System:

For electronic component receiving inspection and inventory management, RAYSOV offers X-ray–based intelligent counting equipment that can rapidly and automatically count surface-mount resistors, capacitors, inductors, ICs, and other components on reel‑tape carriers, while detecting anomalies such as empty reels, stacked components, and flipped parts. This significantly enhances counting efficiency and accuracy, enabling intelligent, traceable material management.

Centered on its proprietary micro‑focus X‑ray source, RAYSOV integrates cutting‑edge technologies such as AI‑driven defect detection, automated programming, and 3D reconstruction to deliver end‑to‑end, high‑resolution inspection solutions—spanning R&D validation through production‑line quality control—for the integrated circuit, electronics manufacturing, and additive manufacturing sectors. These solutions help drive precision manufacturing toward greater accuracy and enhanced reliability.