X-ray tube
X-ray source
Industrial DR
Industrial CT
Microfocus inspection
Orientation Instrument
Diffractometer
Dual-station automatic measurement and bonding machine for ingots
RSO30-06
High-precision crystal orientation measurement
Multi-size compatibility
Closed-loop automatic control of parameters
Stabilize processes to enhance quality.
This system is specifically designed for the roller‑grinding process of semiconductor boules, such as those made of monocrystalline silicon and silicon carbide. Leveraging X-ray diffraction (XRD) technology, it enables on‑line crystallographic orientation measurement with an accuracy of ±30 arcseconds, providing real‑time feedback on angular deviations and automatically executing closed‑loop corrections to roller‑grinding parameters. The system is compatible with boule diameters ranging from 6 to 12 inches and features standardized industrial communication interfaces, supporting seamless integration with a wide range of mainstream roller‑grinding machines and production‑line control systems to ensure consistent processing and stable process performance.
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- Product Introduction
- Technical Specifications
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- Commodity name: Dual-station automatic measurement and bonding machine for ingots
- Commodity ID: RSO30-06
- 设备类型: Directional instrument
- 标签蓝: High-precision crystal orientation measurement
- 标签绿: Multi-size compatibility
- 标签橙: Closed-loop automatic control of parameters
- 标签红: Stabilize processes to enhance quality.
- 检测类型: Crystal Rod Angular Deviation Detection and Correction
- 检测方式: Online Horizontal Drum Grinding Inspection
- 设备类型: Medium-sized equipment
- 特点: Standard Equipment | Crystal Rod Outer Diameter Grinding | Offline Inspection
This system is specifically designed for the roller‑grinding process of semiconductor boules, such as those made of monocrystalline silicon and silicon carbide. Leveraging X-ray diffraction (XRD) technology, it enables on‑line crystallographic orientation measurement with an accuracy of ±30 arcseconds, providing real‑time feedback on angular deviations and automatically executing closed‑loop corrections to roller‑grinding parameters. The system is compatible with boule diameters ranging from 6 to 12 inches and features standardized industrial communication interfaces, supporting seamless integration with a wide range of mainstream roller‑grinding machines and production‑line control systems to ensure consistent processing and stable process performance.
Core Features and Advantages of the Product
Full coverage of wide-bandgap and silicon-based materials
The system is specifically designed for mainstream semiconductor materials such as monocrystalline silicon and silicon carbide, while accommodating the distinct machining characteristics of both hard‑brittle and tough materials.A single system can meet the alignment requirements of multiple materials on the production line, particularly excelling in the precision calibration of difficult-to-machine materials such as silicon carbide. This eliminates accuracy drift caused by material changes and significantly reduces the cost of redundant equipment investments across the line.Precise定向 by X-ray diffraction
By employing established X-ray diffraction techniques in conjunction with a highly sensitive detection system, ultra-high repeatable positioning accuracy is achieved.By controlling the crystallographic orientation deviation of ingots within an extremely narrow tolerance prior to the lapping process, we fundamentally eliminate grinding non-uniformities caused by angular errors. Ensuring consistent angular alignment across batches provides a reliable reference for subsequent operations such as slicing, grinding, and polishing, thereby directly improving the final chip yield.Real-time monitoring and automatic correction closed-loop control
Upon detecting angular deviations in the ingot, the system can provide real-time feedback and automatically adjust the tumbling‑polishing process parameters, thereby establishing a closed-loop control chain that integrates measurement, computation, and execution.It transforms the inefficient, manual, iterative measurement and adjustment process of traditional methods, fully automating calibration and correction workflows. This significantly reduces the preparation time for processing each individual ingot while eliminating the uncertainties introduced by human intervention, resulting in a more stable and better‑controlled manufacturing process.Large‑size compatibility and flexible line integration
Supports ingot sizes from 6 to 12 inches, can be flexibly integrated with various mainstream tumbling and polishing equipment, and comes standard with industrial communication interfaces.As the semiconductor industry advances toward larger‑diameter ingots, the system supports simultaneous upgrades without hardware replacement, safeguarding customers’ long‑term investments. Its standardized communication interface enables rapid integration into existing production‑line control networks, seamlessly interfacing with tumbling and polishing equipment from various brands and models, thereby minimizing retrofit downtime and facilitating swift deployment.Performance Leap
It integrates high-precision measurement, automated control, and production-line operations into a single system, positioning itself as a core efficiency tool for the ingot‑processing stage.Precision targeting and automated correction lead to a significant increase in process yield and a substantial reduction in rework rates. Particularly for high-value materials such as silicon carbide, improved yield translates into substantial cost savings. Automated workflows free operators from tedious manual calibration, simultaneously optimizing labor costs and unlocking production capacity, thereby helping companies achieve their goals of precision manufacturing, cost reduction, and efficiency gains.Detection Feature Demonstration
Precision guidance, intelligent correction
• Based on the principle of X-ray diffraction, it achieves ultra-high repeatability with an accuracy of ±30° (±0.0083°).
• Real-time feedback from the displacement sensor combined with the servo motor’s rapid response enables dynamic correction of the tumbling machine’s swing angle.Wide compatibility, efficient integration
• Supports Ø6"/8"/12" ingots (monocrystalline silicon/silicon carbide) and can be integrated into various grinding equipment.
• Modular design and high‑grade protection standards enable rapid, wide‑range integration into diverse production and research environments.Wide compatibility, efficient integration
• Standard configuration includes TCP/IP and Modbus TCP protocols, with support for SECS/GEM–based custom development.
• High-frequency, high-voltage power supply technology enables stable measurements with a low power consumption of 500 W. -
Project
Content
Product model RSO30-06 Diffraction method Single diffraction Receiving System Scintillation detector, with a count rate of 10⁸ per second. X-ray tube current intensity 0-1.0mA Detection accuracy Single diffraction: accuracy ±30″ (±0.0083°) Power supply Single-phase AC 220 V supply, rated current 2.3 A, rated power 500 W. Inspect workpiece dimensions 6 inches, 8 inches, 12 inches Communication Support TCP/IP, Modbus TCP communication protocol, or a custom communication protocol Main detection scope Equipped with a grinding and sawing machine, it performs angular alignment on the cylindrical or end faces of monocrystalline silicon and silicon carbide, followed by rounding or precision grinding. Scope of Application This system is specifically designed for the semiconductor (single-crystal silicon and silicon carbide), photovoltaic, and precision optics industries. In the orientation‑bonding process performed prior to wire sawing of ingots, it bonds the ingot to the carrier at a precisely controlled crystallographic orientation angle, serving as a core piece of equipment in the front‑end steps of preparing high‑end wafers such as substrate and epitaxial wafers.
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RAYSOV Instrument Co., Ltd.
Address: No. 57, Longteng Avenue, Zhen’an District, Dandong City, Liaoning Province, China
Email:info@raysov.com
Phone:86-415-6277666
Fax: 0415-6277566
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