X-ray tube
X-ray source
Industrial DR
Industrial CT
Microfocus inspection
Orientation Instrument
Diffractometer
X-ray Industrial LCT Inspection System
ZXVoxel U
Laboratory Research
Highly integrated
Desktop device
Precision inspection
The ZXVoxel U‑type is a vertical industrial CT system specifically designed for high‑precision inspection of small to medium‑sized workpieces. Equipped with a 130 kV microfocus X‑ray source and a high‑resolution area‑array detector, the system supports multiple scanning modes, including cone‑beam CT, third‑generation standard scanning, and offset large‑field‑of‑view imaging. It enables nondestructive three‑dimensional inspection and analysis of internal defects, dimensional accuracy, and assembly quality. With its compact design and user‑friendly operation, the system is widely employed in aerospace, automotive manufacturing, next‑generation energy batteries, additive manufacturing, electronics and electrical engineering, materials science, and defense industries.
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- Product Introduction
- Technical Specifications
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- Commodity name: X-ray Industrial LCT Inspection System
- Commodity ID: ZXVoxel U
- 设备类型: Desktop CT
- 检测方式: Single source, single probe
- 检测类型: High-precision CT/DR inspection of small and medium-sized workpieces
- 射线能量: 130 kV
- 特点: Small-scale equipment | Small-part 3D nondestructive testing | Offline inspection
- 标签蓝: Laboratory Research
- 标签绿: Highly integrated
- 标签橙: Desktop device
- 标签红: Precision inspection
- 检测方式: Cone-beam CT • Standard third-generation • Offset large field of view
- 设备类型: Medium-sized upright CT scanner
The ZXVoxel U‑type is a vertical industrial CT system specifically designed for high‑precision inspection of small to medium‑sized workpieces. Equipped with a 130 kV microfocus X‑ray source and a high‑resolution area‑array detector, the system supports multiple scanning modes, including cone‑beam CT, third‑generation standard scanning, and offset large‑field‑of‑view imaging. It enables nondestructive three‑dimensional inspection and analysis of internal defects, dimensional accuracy, and assembly quality. With its compact design and user‑friendly operation, the system is widely employed in aerospace, automotive manufacturing, next‑generation energy batteries, additive manufacturing, electronics and electrical engineering, materials science, and defense industries.
Core Features and Advantages of the Product
Deep Research Empowerment Platform
A full‑chain closed loop spanning motion control, raw data acquisition, high‑precision reconstruction, and 3D quantitative analysis, with built-in specialized analysis modules for complex workpieces.We provide universities and research institutes with a platform for analyzing the internal structural evolution and investigating failure mechanisms of additive‑manufactured parts, composite materials, and precision components, thereby truly bridging the gap from imaging to mechanistic analysis.The system is specifically designed to meet the high‑end quality‑control and analytical needs of small, medium‑sized, and irregular workpieces, providing end‑to‑end coverage—from motion control and raw data acquisition to high‑precision image reconstruction and three‑dimensional quantitative analysis. It supports multiple acquisition modalities, including DR scanning, cone‑beam CT, and large‑field‑of‑view cone‑beam CT, thereby addressing the diverse requirements of various research applications. Paired with 3D visualization software and porosity/inclusion analysis tools, researchers can perform scaling, panning, rotation, measurements, and slice‑based analyses on volumetric data. Based on user‑defined thresholds, the system visually presents the analysis results directly within the 3D data window. This enables in‑depth investigation into the internal structural evolution and failure mechanisms of additively manufactured parts, composite materials, and precision components—going far beyond mere “imaging.”In-depth in-house R&D across the entire industry chain
The core radiation source and the underlying control algorithm are independently developed in a vertically integrated manner, enabling instantaneous and precise coordination among the source, detector, and controller.It completely eliminates communication latency and control errors caused by piecing together multiple brands, with data purity and system stability far surpassing those of comparable assembled products, thereby laying a reliable foundation for precision inspection. RAYSOV is one of the very few domestic companies with end-to-end, independently developed capabilities—offering comprehensive, in-house solutions for industrial radiography spanning 30 keV to 15 MeV, with full independent control over everything from the X-ray source and high-frequency high-voltage generator to complete DR/CT systems. The ZXVoxel U‑shaped system features a 130 kV microfocus X‑ray tube designed and manufactured in‑house by RAYSOV, delivering a more compact footprint and higher standardization. RAYSOV’s Jingshi CT subsidiary boasts a software development team led by PhDs, committed to mastering core algorithms and proprietary code; while building on standardized industrial CT platforms, it continuously upgrades and delivers tailored solutions to meet customers’ specific needs. All critical components are independently researched and produced, ensuring stable performance and superior image quality.Desktop‑grade, highly protective integrated design
A compact, integrated vertical architecture that highly integrates a high-precision motion system with a fully shielded lead enclosure, occupying minimal floor space and featuring built-in comprehensive radiation protection.The laboratory is ready to use as soon as power is connected, significantly lowering the barrier to deploying high-end C‑class equipment and maximizing the value of limited space.The system features a compact, integrated vertical design that highly integrates the X-ray source, detector, high-precision mechanical motion system, electrical control system, and protective lead enclosure. Each linear axis is equipped with dual-stage collision‑prevention limit switches and an emergency stop button, and all travel ranges employ a parallel dual‑limit configuration to prevent equipment damage in the event of a single‑point failure. The system complies with national standards, maintaining a dose rate of less than 1.0 µSv/h on the outer surface of the lead enclosure during normal operation. It supports AC 220/380 V power supply—single‑phase or three‑phase—and can be commissioned simply by connecting it to the mains. Even within constrained laboratory bench space, it enables safe, compliant, high‑precision CT imaging, significantly lowering the barriers to deploying advanced inspection equipment.Intelligent algorithms empower precision inspection.
The micro‑focus X‑ray source and high‑fidelity detector hardware deliver exceptional detail‑capture performance, complemented by a patented ADR algorithm for automated defect detection and adaptive image filtering.For workpieces with complex geometries, intelligent algorithms automatically identify subtle defect signatures, converting ambiguous signals into clear, definitive results and significantly enhancing both detection efficiency and consistency. RAYSOV advances X‑ray imaging inspection systems through its proprietary ADR (Automatic Defect Recognition) technology; its patented Raylion image‑filtering capability enables users to more precisely discern defect features in intricately shaped areas, thereby improving on‑site inspection throughput. The image‑processing software offers a range of functions, including window/level adjustment, filtering and noise reduction, local enhancement, and pseudocolor rendering, while supporting defect measurement, annotation, and the generation of inspection reports. Analytical measurement tools encompass point‑based gray‑level analysis, density measurement, and regional gray‑level statistics. Meanwhile, the acquisition and motion‑control software provides image correction, multiple scanning modes, parameter configuration, and batch‑mode invocation. For parts with complex shapes, intelligent algorithms can autonomously extract faint defect features, transforming indistinct signals into unambiguous verdicts, greatly reducing the complexity of manual interpretation.
Detection Feature Demonstration
Control system DR Image Processing 
3D visualization software Porosity/Inclusion Analysis Software -
Project
Parameter
Source Exploration Combination Single source, single probe X-ray tube type Microfocus (Closed-Tube) Tube voltage 130kV Detector Type Area-array detector Imaging area 250mm × 300mm Maximum resolution 3 μm Maximum Workpiece Size for Inspection (I) φ250mm × 140mm Maximum Workpiece Size for Inspection (II) φ300mm × 60mm Maximum workpiece weight for inspection 5kg / 10kg Device dimensions (approx.) 1000mm × 600mm × 650mm Structural form Vertical Scope of Application
ZXVoxel U is suitable for high-precision CT/DR nondestructive testing of small and medium-sized components in fields such as aerospace, automotive manufacturing, new‑energy batteries, additive manufacturing, electronics and electrical engineering, materials science, defense industries, and research institutes.
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RAYSOV Instrument Co., Ltd.
Address: No. 57, Longteng Avenue, Zhen’an District, Dandong City, Liaoning Province, China
Email:info@raysov.com
Phone:86-415-6277666
Fax: 0415-6277566
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