X-ray tube
X-ray source
Industrial DR
Industrial CT
Microfocus inspection
Orientation Instrument
Diffractometer
Crystal Rod/ wafer orienter
RSO30-01
High-precision crystal orientation measurement
Duplex multidimensionality
Precise and interference-free
Easy to adapt and maintain
The RSO30-01 high‑precision crystal orientation detector is a specialized inspection instrument for quality control in semiconductor manufacturing, custom‑designed for highly accurate measurement of crystal orientation angles on ingots and wafers. The device features a flexible dual‑station configuration, effortlessly accommodating multi‑scenario, multi‑dimensional inspections of end faces, cylindrical surfaces, and more. Equipped with a high‑sensitivity scintillation detector, it delivers superior signal‑capture accuracy with no spurious peaks, ensuring clean and reliable results. It supports switching between single‑diffraction and double‑diffraction modes, achieving a maximum measurement precision of ±0.004° to guarantee stable, dependable data from the outset. The system is compatible with 2‑inch, 4‑inch, and 6‑inch samples, and its X‑ray tube offers long service life and low radiation dose, while requiring simple, convenient routine maintenance. It is the ideal choice for verifying process quality and maintaining process stability throughout semiconductor production.
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- Product Introduction
- Technical Specifications
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- Commodity name: Crystal Rod/ wafer orienter
- Commodity ID: RSO30-01
- 设备类型: Directional instrument
- 标签蓝: High-precision crystal orientation measurement
- 标签绿: Duplex multidimensionality
- 标签橙: Precise and interference-free
- 标签红: Easy to adapt and maintain
- 检测类型: Crystal Rod Angle Measurement,Chip Angle Measurement
- 检测方式: Horizontal dual-station inspection
- 设备类型: Medium-sized equipment
- 特点: Standard Equipment | Crystallographic Precision Positioning | Offline Inspection
The RSO30-01 high‑precision crystal orientation detector is a specialized inspection instrument for quality control in semiconductor manufacturing, custom‑designed for highly accurate measurement of crystal orientation angles on ingots and wafers. The device features a flexible dual‑station configuration, effortlessly accommodating multi‑scenario, multi‑dimensional inspections of end faces, cylindrical surfaces, and more. Equipped with a high‑sensitivity scintillation detector, it delivers superior signal‑capture accuracy with no spurious peaks, ensuring clean and reliable results. It supports switching between single‑diffraction and double‑diffraction modes, achieving a maximum measurement precision of ±0.004° to guarantee stable, dependable data from the outset. The system is compatible with 2‑inch, 4‑inch, and 6‑inch samples, and its X‑ray tube offers long service life and low radiation dose, while requiring simple, convenient routine maintenance. It is the ideal choice for verifying process quality and maintaining process stability throughout semiconductor production.
Core Features and Advantages of the Product
Multi-axis coordinated mechanical system with full degrees of freedom and seamless, dead‑zone‑free coverage.
The system is equipped with a multi-degree-of-freedom motion platform, enabling the X-ray source to move in multiple directions and to be tilted at various spatial angles. The detector also features independent motion capabilities, and, in conjunction with automated workpiece rotation and translation, all motion axes can be programmed for coordinated control.Whether it’s small‑diameter welded pipes, large‑diameter thick‑walled vessels, or custom‑shaped non‑standard workpieces, full‑circumferential, multi‑angle, dead‑zone‑free imaging inspection can be achieved. With precise mechanical motion and rapid response, it fully resolves the challenges of adjusting inspection orientations for complex components, eliminating the need for repeated manual intervention and significantly enhancing both inspection efficiency and consistency.AWR fully automated inspection process, seamlessly integrated with the production line.
It integrates AWR’s automatic pipe feeding, automatic weld‑joint positioning, automatic clamping, and full‑sequence pipe‑turning functions; supports data exchange with MES/MOM systems; automatically retrieves workpiece information; guides the weld seam to the inspection station; and automatically outputs the part upon completion of inspection.The entire process requires no manual intervention, with workpieces continuously and automatically fed in and out, significantly reducing operator workload and seamlessly supporting high‑throughput, on‑line, takt‑time‑driven inspection. Full‑process data is automatically traceable, meeting the stringent “one part, one record” requirement for granular management and integrating seamlessly into existing smart production lines.Intelligent data collection and end-to-end traceability ensure hassle-free data management.
Supports automatic QR code scanning to retrieve workpiece information from the MOM system, automatically matches and configures flaw‑detection acquisition parameters, and automatically generates image file names and overlays relevant data (including workpiece ID, operator ID, and inspection parameters). Upon completion of data acquisition, the results are automatically uploaded to the quality management system.Workpiece codes are automatically aligned, and files are automatically categorized and archived, mechanically eliminating manual data entry and the risk of errors. The entire inspection data workflow is fully traceable, providing a complete and reliable evidence chain to support the stringent archival management, quality traceability, and liability determination requirements of the special‑equipment industry.Automatic defect marking plus precise measurement ensures efficient and accurate rework localization.
The system supports automatic defect‑location marking on workpieces based on recognition results, and it also integrates a variety of quantitative image‑analysis tools, including dimension measurement, gray‑level analysis, and signal‑to‑noise ratio assessment.Defect locations are visually apparent, enabling repair personnel to pinpoint defects accurately without the need for secondary nondestructive testing, thereby significantly reducing rework time. The multi‑dimensional measurement capabilities meet the standard’s requirements for quantitative verification of image quality, making the evaluation process more objective and standardized and providing a quantifiable basis for process assessment.Automatic defect marking combined with dual monitoring of distance and angle ensures precise and efficient rework positioning.
It integrates a defect‑marking device that automatically marks defect locations on the weld‑joint side based on intelligent recognition results. It is also equipped with a real-time distance and angle monitoring and feedback system, enabling quantitative tracking of the straight‑pipe conveying distance and rotational angle.Defect locations are clearly identifiable, eliminating the need for repeated nondestructive testing during repair and significantly improving efficiency. Closed-loop monitoring of distance and angle ensures the repeatability and consistency of multi‑angle radiographic inspections, providing a stable and reliable positional reference for automated inspection and ensuring highly controllable inspection conditions across batches.Intelligent Image Evaluation ADR System (optional)
An optional intelligent weld‑defect assessment system is available, featuring built-in model algorithms tailored to various welding processes. It simultaneously supports the detection of both surface and internal defects, delivering high accuracy in defect classification and achieving a zero false‑negative rate for critical defects.It significantly reduces the workload of film‑inspection personnel during high‑volume, continuous inspections, and by minimizing the risk of missed defects, it provides the highest level of assurance for component service safety. The system delivers real‑time alerts based on its analysis and supports automatic pausing for manual review and confirmation, thereby establishing an efficient, scientifically sound workflow that combines AI‑driven preliminary screening with human‑machine collaboration.Detection Feature Showcase
1# Worktable single diffraction ±30° (±0.0083°) 2# Worktable dual diffraction ±15" (±0.0042°) 
Division of labor between two workstations
One device, multiple capabilities—simultaneously meets both end-face and cylindrical surface requirements, significantly boosting inspection efficiency.
Ultra-high-sensitivity detector
Counting rate of 10^8 counts per second, with no need for repeated adjustments, accurately capturing valid signals.
Modular design
It can be equipped with various types of sample stages and extended with customized measurement capabilities as needed.
Long-lasting operation with low maintenance
An optimally designed X-ray system, operating with low energy consumption, ensures the equipment’s long-term stable performance.
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Parameter item
Parameter Details
Diffraction method Single diffraction, double diffraction (two options) Receiving System Scintillation detector, with a count rate of 108108 counts per second. X-ray tube current intensity 0-1.0mA Detection accuracy Single diffraction: accuracy ±±30 seconds (or ±±0.0083 degrees) Double diffraction: accuracy ±±15 arcseconds (or ±±0.0042 degrees) Display System Displays in degrees, minutes, and seconds; manually sets the standard angle; and shows in real time the angular deviation between the crystal under test and the standard angle. Angle measurement Measurement angle range: θθ: -5° to +50° Inspect workpiece dimensions 2 inches, 4 inches, 6 inches, length ≤≤ 200 mm Power supply Single-phase AC 220 V supply, rated current 0.9 A, rated power 200 W. Main detection scope Wafer inspection: primarily used to verify the quality of products after dicing, polishing, or other corresponding process steps. Ingot inspection: Primarily used to verify the product quality of ingots after roller rounding, cutting, edge trimming, or other corresponding processing steps. Scope of Application Used in the quality control stage of semiconductor manufacturing, it enables high-precision crystallographic orientation angle measurement across multiple scenarios for 2-, 4-, and 6-inch wafers and ingots, ensuring processing quality and maintaining process stability.
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RAYSOV Instrument Co., Ltd.
Address: No. 57, Longteng Avenue, Zhen’an District, Dandong City, Liaoning Province, China
Email:info@raysov.com
Phone:86-415-6277666
Fax: 0415-6277566
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