The RSO30-07 dual‑station ingot measurement and bonding machine integrates orientation, measurement, and bonding into a single system. Featuring a dual‑station collaborative operation and a dual X‑ray measurement system, it delivers high‑precision automated processing, supports MES integration, and enhances both efficiency and yield.

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Product Introduction
Technical Specifications

- Commodity name: Dual-station automatic measurement and bonding machine for ingots
- Commodity ID: RSO30-07
- 设备类型: Directional instrument
- 标签蓝: High-precision testing
- 标签绿: Dual-Position Coordination
- 标签橙: Intelligent Automatic Control
- 标签红: Improve quality and increase efficiency
- 检测类型: X-ray Orientation and Bonding Angle Measurement of Crystal Rods
- 检测方式: Dual-station automatic horizontal inspection
- 设备类型: Large equipment
- 特点: Medium-sized equipment | Dual-station precision grinding | In-line automated inspection
The RSO30-07 dual‑station ingot measurement and bonding machine integrates orientation, measurement, and bonding into a single system. Featuring a dual‑station collaborative operation and a dual X‑ray measurement system, it delivers high‑precision automated processing, supports MES integration, and enhances both efficiency and yield.

Functional module	Technical Specifications
Directional System	Dual‑set X-ray measurement system (with automatic positioning on the X and Y axes), arranged at a 90° angle to each other.
probe	High-sensitivity scintillation detector
Directional Accuracy/Bonding Angle	±30″/≤±0.05°
Automation features	Fully automatic alignment, measurement, rotation, and bonding, with one-touch operation.
Crystal Rod Positioning	Infrared positioning + laser automatic positioning NOTCH/OF surface system
Mechanical Control	The dual-axis robotic arm performs rotational alignment, driven directly by a motor.
Bonding Pressure Control	Adjustable pressure range: 50–200 N, with real-time monitoring.
Viscose method	Automatic pulse-type adhesive application, with support for fine adjustments to the resin strip position.
Base compatibility	Compatible with wire-cutting machine material holders (customizable), supporting the splicing of multiple ingots (with adjustable gap settings).
Operation interface	Selectable touchscreen with anti-misoperation design
Memory function	Device parameter memory; no need for repeated calibration.
Real-time monitoring	Real-time display of X/Y-axis deviation angle, bonding pressure, and adhesive position.
False alarm	Automatic alarm for operational errors or out-of-range conditions.
Data Management	The internal database stores process parameters and supports data upload and barcode-based traceability.
Remote support	Remote Data Analysis and Fault Diagnosis
Extended Optional Configuration	Automatic loading and unloading system, with multiple machines operating in coordinated parallel mode.
Automatic Gluing Device (Fully Automatic Glue Mixing and Application)
SECS/GEM or TCP/IP communication protocols, interfacing with MES and unmanned factories. Adhesive rapid-curing module, enhancing production throughput. The die seat features a specialized design, with process parameters finely tuned to match.
Scope of Application
This system is specifically designed for the pre‑cutting alignment and bonding process in the semiconductor, photovoltaic, and precision optics industries. It is compatible with a wide range of materials and carrier substrates, making it widely applicable to the front‑end stages of high‑end crystal fabrication.

Dual-station automatic measurement and bonding machine for ingots

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