Specifically designed for high-precision electronic component inspection, it can efficiently detect pad defects such as voids and solder bridges, and supports multiple package types including BGA and QFN. It features automated inspection and rapid programming capabilities. The equipment is widely used for full‑field inspection of SMT circuit board assemblies, FPC flexible‑circuit assemblies, semiconductor devices, and precision structural components.

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Product Introduction
Technical Specifications
Application Cases

- Commodity name: Online Micro-Focus Inspection
- Commodity ID: AXI8500
- 设备类型: Microfocus inspection
- 标签蓝: High-Definition Imager
- 标签绿: Precise inspection of virtual solder joints
- 标签橙: One-click changeover
- 标签红: Intelligent operation
- 检测类型: Online individual testing
- 检测方式: 2D/2.5D
- 光管电压: 90kV/130kV
- 特点: Standard Equipment | Electronic X-Ray | In-Line Inspection on the Production Line
Specifically designed for high-precision electronic component inspection, it can efficiently detect pad defects such as voids and solder bridges, and supports multiple package types including BGA and QFN. It features automated inspection and rapid programming capabilities. The equipment is widely used for full‑field inspection of SMT circuit board assemblies, FPC flexible‑circuit assemblies, semiconductor devices, and precision structural components.

Inspected product
Application	The equipment is widely used for full‑field inspection of SMT circuit board assemblies, FPC flexible circuit assemblies, semiconductor devices, and precision structural components.
I. Main Parameters
Parameter Name	Parameter value
Lamp tube voltage	90kV/130kV
Pixel matrix	1536*1536
Probe	High-definition FPD
Overall weight (approx.)	3500kg
Overall dimensions (approx.)	1.6(W)×1.65(D)×1.85(H)m
Maximum cargo area	1000*500mm
Minimum cargo area	100×50 & 50×50 mm
Maximum detection area	600*500mm

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