X-ray tube
X-ray source
Industrial DR
Industrial CT
Microfocus inspection
Orientation Instrument
Diffractometer
Manual material-attaching machine for ingots
RSO30-02
Biaxial measurement deviation
Workstation closed-loop adjustment
High precision, no interference
Multipath low radiation
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- Product Introduction
- Technical Specifications
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- Commodity name: Manual material-attaching machine for ingots
- Commodity ID: RSO30-02
- 设备类型: Directional instrument
- 标签蓝: Biaxial measurement deviation
- 标签绿: Workstation closed-loop adjustment
- 标签橙: High precision, no interference
- 标签红: Multipath low radiation
- 检测类型: Measurement of the angular deviation of the ingot along the X and Y axes,Bonding and Positioning
- 检测方式: Horizontal dual-station inspection
- 设备类型: Medium-sized equipment
- 特点: Standard Equipment | Crystal Rod Bonding and Fixing | Offline Inspection
Core Features and Advantages of the Product
Dual-station independent angular measurement system, precisely positioning the cutting datum for ingots.
Innovatively equipped with a dual‑station independent measurement system, it enables step‑by‑step detection of the crystal rod’s X/Y‑axis deviation angles. Featuring a directly coupled high‑precision spindle and an optoelectronic sensing architecture, it further enhances mechanical motion accuracy and response speed. Station #1 supports grinding‑and‑clamping alignment, providing a precise reference for correcting the crystal rod’s angular position; Station #2 is fitted with an adhesive‑adjustment knob, facilitating rapid positional calibration after angle measurement and enabling a closed‑loop workflow that integrates measurement, adjustment, and machining. The entire machine structure has been optimized for rigidity, ensuring stable mechanical performance even under high‑intensity continuous operation.Dual-axis angular measurements can be completed in a single clamping operation, replacing the cumbersome step-by-step process of conventional methods. This dramatically reduces auxiliary setup time while fundamentally eliminating secondary positioning errors and cumulative deviations caused by repeated loading and unloading. The direct‑drive spindle, working in concert with photoelectric sensors, significantly enhances mechanical motion accuracy, providing a stable and reliable angular reference for the cutting process and ensuring wafer perpendicularity and material utilization from the outset. A dual‑station collaborative design seamlessly integrates measurement and adjustment steps, enabling operators to perform the entire workflow—from inspection to correction—without moving the ingot. This effectively minimizes variations in machining allowances during downstream processes such as grinding and polishing, substantially improving overall ingot yield and batch-to-batch consistency. Robust hardware rigidity and stability ensure that the equipment maintains high repeatability even during prolonged continuous operation, reducing the frequency of periodic recalibration. This makes it particularly well suited for high‑end semiconductor material processing applications with stringent crystallographic orientation requirements, providing customers with solid support for stable, efficient, and sustainable large‑scale production.Flexible and compatible design, supporting mainstream ingot specifications.
The equipment supports highly stable measurements across a wide range of ingot diameters and is compatible with the mainstream size grades used in semiconductor ingot processing. Both the probe and the positioning mechanism feature a modular design, enabling quick and seamless switching between different specifications.There is no need to replace core components or perform complex mechanical adjustments for different ingot sizes; a single system can seamlessly handle rapid changeovers across multiple specifications and product variants, reducing upfront capital expenditures and minimizing downtime during format changes. The fixture and positioning structure have been optimized to maintain excellent mechanical stability even when measuring large‑size ingots, ensuring that measurement accuracy remains consistent despite size variations. A modular changeover approach lowers the technical skill threshold for operators, making setup quick and straightforward while minimizing variability introduced by manual adjustments. This solution is particularly well suited to semiconductor material‑processing facilities engaged in mixed‑batch production, enabling flexible responses to diverse order requirements and helping customers achieve more efficient line scheduling at a lower total cost of ownership, thereby enhancing overall equipment utilization and return on investment.High-purity signal acquisition + low-radiation X-rays ensure safe and reliable detection.
Equipped with advanced scintillation detectors, it delivers exceptional energy resolution, effectively filtering out background and environmental stray radiation to ensure a clean signal free of spurious peaks. Paired with a low‑radiation X‑ray system, it controls radiation dose at the source, balancing detection performance with occupational safety. The system incorporates multi‑layered shielding throughout, ensuring that radiation safety parameters during operation consistently meet the industry’s most stringent standards.Pure signal output ensures the accuracy and repeatability of angle measurements, delivering reliable and trustworthy results that provide robust data support for process validation. This helps avoid misjudgments and redundant verification caused by spurious peaks, while significantly reducing the costs associated with repeated testing due to signal drift. The low‑radiation design not only meets the demands of precision inspection but also substantially minimizes radiation exposure to operators and the surrounding environment, allowing the equipment to be safely deployed alongside production lines or in open workshop areas without the need for additional heavy shielding, thereby saving space and reducing ancillary investment. Moreover, the X‑ray tube boasts a long service life and easy maintenance, effectively decreasing equipment downtime for servicing and lowering consumable replacement costs, thus cutting overall operating expenses. With comprehensive safety features and low‑radiation characteristics working in concert, this equipment satisfies stringent angular measurement requirements while prioritizing operator safety, environmental compliance, and long‑term economic efficiency—making it an ideal choice for enterprises seeking green manufacturing and sustainable production.Detection Feature Showcase
1# Worktable measurement of the Y-axis deviation angle of the ingot 2# Worktable measurement of the X-axis deviation angle of the ingot 
Division of labor between two workstations
The standalone workstation performs high-precision X/Y-axis measurements, directly guiding grinding and bonding operations.
High-precision transmission mechanism
Optoelectronic sensing directly drives the spindle, replacing the worm gear and worm, thereby effectively improving motion accuracy.
Integrated tooling
Workstation #1 is equipped with various grinding and polishing fixtures, while Workstation #2 integrates a bonding knob, ensuring seamless integration of measurement and machining processes.
Long-lasting operation with low maintenance
Counting rate of 10^8 counts per second, with no need for repeated adjustments, accurately capturing valid signals.
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Parameter item
Parameter Details
Diffraction method Single diffraction, double diffraction (two options) Receiving System Scintillation detector X-ray tube current intensity Adjustable Detection accuracy Dual-mode high-precision angle measurement, meeting the requirements of various crystal orientation inspections. Display System Displays in degrees, minutes, and seconds; supports manual setting of standard angles; and shows the deviation between the measured crystal and the standard angle in real time. Angle measurement Covers the mainstream range of crystal rod and wafer orientation angles. Inspect workpiece dimensions Compatible with multiple diameter specifications and supports workpieces of standard lengths. Power supply Single-phase power supply, low-power design Main detection range Wafer inspection: used to verify the quality of products after cutting, polishing, or other corresponding processing steps; ingot inspection: used to verify the quality of ingots after rounding, slicing, edge‑trimming, or other corresponding processing steps. Scope of Application It is suitable for precision measurement of crystallographic orientation angles and quality control in pre‑cutting processes such as rod rounding, truncation, and edge‑facing, as well as in post‑cutting and post‑polishing procedures.
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RAYSOV Instrument Co., Ltd.
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