The ZXVoxel C‑type X‑ray industrial CT inspection system is a high‑resolution, standardized industrial CT device specially developed by RAYSOV Radiography for small and medium‑sized irregular workpieces. The system features an open‑architecture microfocus X‑ray tube with a reflective target, paired with a large‑field‑of‑view, high‑performance area‑array detector. It supports multiple inspection modes, including DR scanning, cone‑beam CT standard scanning, and offset wide‑field scanning, meeting the inspection needs of the vast majority of small and medium‑sized precision components. All core components are independently developed and fully controllable, complemented by end‑to‑end intelligent software for data acquisition and control, 3D reconstruction, porosity analysis, and more. The system delivers exceptional microfocus imaging quality and stable performance, with radiation protection exceeding national standards. It is widely used in aerospace, defense, additive manufacturing, precision casting, composite materials, electronics and electrical engineering, as well as research institutes, providing an ultra‑high‑resolution nondestructive testing solution for internal defect detection and structural analysis of small and medium‑sized precision parts.

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Product Introduction
Technical Specifications
Case image

- Commodity name: Vertical Micro-Focus Industrial CT Inspection System
- Commodity ID: ZXVoxel C
- 设备类型: Medium-sized vertical micro-CT
- 检测方式: Single source, single probe,Dual-source single probe
- 检测类型: Offline individual testing
- 射线能量: 160kV|225kV|300kV
- 特点: Standard Equipment | General-Purpose Component Flaw Detection | Offline Inspection
- 标签蓝: Vertical Micro-CT
- 标签绿: Can be equipped with a dual source.
- 标签橙: Inspection of Small and Medium-Sized Precision Workpieces
- 标签红: Internal Defect Analysis
The ZXVoxel C‑type X‑ray industrial CT inspection system is a high‑resolution, standardized industrial CT device specially developed by RAYSOV Radiography for small and medium‑sized irregular workpieces. The system features an open‑architecture microfocus X‑ray tube with a reflective target, paired with a large‑field‑of‑view, high‑performance area‑array detector. It supports multiple inspection modes, including DR scanning, cone‑beam CT standard scanning, and offset wide‑field scanning, meeting the inspection needs of the vast majority of small and medium‑sized precision components. All core components are independently developed and fully controllable, complemented by end‑to‑end intelligent software for data acquisition and control, 3D reconstruction, porosity analysis, and more. The system delivers exceptional microfocus imaging quality and stable performance, with radiation protection exceeding national standards. It is widely used in aerospace, defense, additive manufacturing, precision casting, composite materials, electronics and electrical engineering, as well as research institutes, providing an ultra‑high‑resolution nondestructive testing solution for internal defect detection and structural analysis of small and medium‑sized precision parts.

Core Features and Advantages of the Product

Micro‑focus ultra‑high resolution enables precise detection of extremely fine defects.

Features: The system employs an open‑type reflective‑target microfocus X‑ray tube independently developed by RAYSOV, with optional 225 kV or 300 kV energy configurations. It features automatic tube conditioning, automatic filament calibration, and automatic electrical… The beam‑centering function and JIMA card calibration resolution can reach 2.0 μm (at 225 kV) and 3.0 μm (at 300 kV), respectively. The detector is equipped with a high‑resolution configuration featuring 100‑μm pixels and a 4288×4288 matrix. Area-array detector with a resolution reaching an ultimate spatial resolution of 5.0 line pairs per millimeter.

Advantages:

● With 2–3 μm‑class microfocus capability, it can clearly detect extremely fine defects such as sub‑micron cracks, micro‑porosity, and porosity.

● Meets the most stringent inspection requirements for high-value components such as aeroengine blades, precision castings, and additively manufactured parts.

● The open-tube reflector design supports on-site filament replacement, significantly reducing long-term operating costs.

● Automatic electron-beam alignment ensures focal stability, guaranteeing consistent image quality during prolonged scanning.

Multiple scanning modes, flexibly adapting to complex inspection requirements.

Features: The system supports three operating modes: DR scanning, standard cone-beam CT scanning (third-generation), and large-field-of-view cone-beam CT scanning with gantry offset. In the offset scanning mode, horizontal movement of the workpiece enables… At least half of the region is within the imaging field of view, enabling wide‑field tomography that exceeds the physical dimensions of the detector.

Advantages:

● DR mode is ideal for rapid fluoroscopic screening, delivering images in seconds and enabling intuitive assessment of internal structural abnormalities.

● The standard CT mode provides images of any cross-section, enabling precise localization of defects in the workpiece’s two‑dimensional or three‑dimensional space.

● The biased CT mode overcomes the physical size limitations of detectors, enabling inspection of medium- to large-sized workpieces with a maximum diameter of 350 mm.

● Multi‑functional, meeting both the precise quantitative testing requirements of the R&D phase and the rapid batch screening needs of the production line.

High-precision multi-axis motion system with dual limit-switch safety redundancy.

Features: The mechanical system employs high-precision servo control for the turntable’s translation, lateral movement, rotation, and lifting; all linear motion axes are equipped with dual protection—electronic limit switches and mechanical hard stops. The motion axis is equipped with a high-precision grating scale, enabling real-time dynamic compensation.

Advantages:

● The servo drive ensures precise motion positioning, and when paired with an optical encoder, achieves sub-micron-level repeatable positioning accuracy.

● The dual limit‑switch design effectively prevents overtravel collisions caused by operator error or software malfunctions, safeguarding both the workpiece and the equipment.

● The turntable has a maximum load capacity of 50 kg, meeting the requirements for testing medium-sized components and multiple samples simultaneously.

● The motion axes can be controlled independently or coordinated in tandem, facilitating the development of customized scanning trajectories.

Sub-micron dimensional measurement accuracy empowers precision manufacturing and reverse engineering.

Features: The system achieves a dimensional measurement accuracy of up to 5.0 μm (in micro‑focus mode), coupled with high‑precision grating‑scale closed‑loop feedback on its motion axes (rotary stage with 600 mm translation, and lateral travel of ±300 mm, (300 mm travel) to ensure dual‑precision performance for both motion and imaging.

Advantages:

● A measurement accuracy of 5 μm meets the stringent dimensional tolerance requirements of industries such as aerospace, precision machinery, and medical devices.

● Nondestructive three-dimensional measurement of internal features of workpieces (internal cavity dimensions, wall thickness, clearances, and coaxiality) is possible.

● Supports reverse engineering: reconstructs a three-dimensional model of the workpiece via CT scanning and performs comparative analysis against the CAD design model.

● Real-time dynamic compensation using an optical grating scale eliminates cumulative errors accumulated over prolonged machine operation.

Detection Feature Showcase

Control system

DR Image Processing

3D visualization software

Porosity/Inclusion Analysis

Inspected product
Application	Aerospace and defense, new-energy vehicles, additive manufacturing, composite materials, electronics and electrical engineering, materials science, and more.
Maximum Equivalent Steel Thickness for Penetration	30mm
Maximum diameter of inspectable workpiece	400mm
Maximum height of inspectable workpiece	500mm
Maximum weight of inspectable workpiece	50kg
Imaging performance
Like a quality indicator sensitivity	Better than 1.0%
Microfocus resolution (JIMA card verification)	2.0 μm
CT density resolution	≤1.0%
System Features
X-ray energy	225 kV \| 300 kV (open-tube reflection target) / 160 kV (open-tube transmission target)
Imaging area	430mm×430mm

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