customized ingot measurement and bonding machine oem
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Dual-station automatic measurement and bonding machine for ingots
The RSO30-07 dual‑station ingot measurement and bonding machine integrates orientation, measurement, and bonding into a single system. Featuring a dual‑station collaborative operation and a dual X‑ray measurement system, it delivers high‑precision automated processing, supports MES integration, and enhances both efficiency and yield.
Ingot Measurement and Bonding Machine: Precision Equipment for Semiconductor Manufacturing
Ingot Measurement and Bonding Machine provides precise measurement and reliable bonding processes for semiconductor materials, improving production accuracy and efficiency in manufacturing.
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RAYSOV Instrument Co., Ltd.
Address: No. 57, Longteng Avenue, Zhen’an District, Dandong City, Liaoning Province, China
Email:info@raysov.com
Phone:86-415-6277666
Fax: 0415-6277566
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